SIP’s integrated circuit (IC) industry achieved remarkable progress in 2025, with its size exceeding RMB100 billion.
SIP began to implement an action plan in 2022 with the aim of comprehensively fostering an IC innovation cluster over the next few years. So far, a more resilient, vigorous and sustainable ecosystem has taken shape.
Currently, SIP is home to over 200 IC-focused enterprises above the designated size, with chip design leading growth. Six of the world’s top ten packaging and testing companies have established operations here, while wafer manufacturing continues to advance steadily.
Breakthroughs in core technologies have driven competitiveness. A number of companies have reported new achievements in chips, epitaxial wafers and other products.
These achievements stem from SIP’s all-around support, including technology innovation platforms, policies, funding and partnering and networking events. So far, a list of companies have received honors for intelligent and green manufacturing and innovations in products and technologies. High-quality products are increasing and the IC community is expanding.
January 27, 2026
